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| MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor-based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed-in-package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3-pin TO-92, micro size TSOP-5, 8-pin SOIC-8 and Micro8t surface mount packages. The NCV device is packaged in SOIC-8 and TO-92. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. Features http://onsemi.com SOIC-8 D SUFFIX CASE 751 Micro8 DM SUFFIX CASE 846A TSOP-5 SN SUFFIX CASE 483 Pin 1. 2. 3. 4. 5. Ground Input Reset NC NC 8 1 8 1 5 1 * * * * * * * * * * * Trimmed-In-Package Temperature Compensated Reference Comparator Threshold of 4.6 V at 25C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable of Sinking in Excess of 10 mA Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Reset Operation with 1.0 V Input Low Standby Current Economical TO-92, TSOP-5, SOIC-8 and Micro8 Surface Mount Packages NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Pb-Free Packages are Available Input Reset TO-92 P SUFFIX CASE 29 Pin 1. Reset 2. Input 3. Ground 3 STRAIGHT LEAD BULK PACK 12 1 3 BENT LEAD TAPE & REEL AMMO PACK 2 PIN CONNECTIONS Reset 1 Input 2 N.C. 3 Ground 4 (Top View) 8 N.C. 7 N.C. 6 N.C. 5 N.C. 1.2 Vref ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. GND = Sink Only Positive True Logic DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. This device contains 21 active transistors. Figure 1. Representative Block Diagram (c) Semiconductor Components Industries, LLC, 2008 August, 2008 - Rev. 18 1 Publication Order Number: MC34064/D MC34064, MC33064, NCV33064 MAXIMUM RATINGS Rating Power Input Supply Voltage Reset Output Voltage Reset Output Sink Current (Note 2) Clamp Diode Forward Current, Reset to Input Pin (Note 2) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air Operating Junction Temperature Operating Ambient Temperature MC34064 MC33064 NCV33064 Storage Temperature Range Symbol Vin VO ISink IF Value -1.0 to 10 10 Internally Limited 100 Unit V V mA mA PD RqJA PD RqJA PD RqJA TJ TA 625 200 625 200 520 240 +150 0 to +70 -40 to +85 -40 to +125 -65 to +150 mW C/W mW C/W mW C/W C C Tstg C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) Characteristics COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA) (Vin = 4.0 V, ISink = 2.0 mA) (Vin = 1.0 V, ISink = 0.1 mA) Output Sink Current (Vin, Reset = 4.0 V) Output Off-State Leakage (Vin, Reset = 5.0 V) Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA) TOTAL DEVICE Operating Input Voltage Range Quiescent Input Current (Vin = 5.0 V) Vin Iin 1.0 to 6.5 - - 390 - 500 V mA VOL - - - 10 - 0.6 0.46 0.15 - 27 0.02 0.9 1.0 0.4 0.1 60 0.5 1.2 V VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 V Symbol Min Typ Max Unit ISink IOH VF mA mA V 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Thigh = +70C for MC34064 4. Tlow = 0C for MC34064 -40C for MC33064 +85C for MC33064 -40C for NCV33064 +125C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 2 MC34064, MC33064, NCV33064 10 RL = 10 k to Vin TA = 25C VO , OUTPUT VOLTAGE (V) VO , OUTPUT VOLTAGE (V) 8.0 6.0 4.0 2.0 0 4.0 3.0 2.0 1.0 0 5.0 RL = 10 k to Vin TA = 25C 0 2.0 4.0 6.0 Vin, INPUT VOLTAGE (V) 8.0 10 4.560 4.580 4.600 Vin, INPUT VOLTAGE (V) 4.620 4.640 Figure 2. Reset Output Voltage versus Input Voltage Figure 3. Reset Output Voltage versus Input Voltage 4.630 V th, THRESHOLD VOLTAGE (V) RL = 10 k to Vin 4.620 4.610 4.600 4.590 4.580 4.570 -55 Lower Threshold Low State Output -25 0 25 50 75 100 125 I in , INPUT CURRENT (mA) Upper Threshold High State Output 1.0 0.8 0.6 +85C 0.4 0.2 0 TA = +25C +85C -40C TA = +25C -40C 0 2.0 4.0 6.0 8.0 10 TA, AMBIENT TEMPERATURE (C) Vin, INPUT VOLTAGE (V) Figure 4. Comparator Threshold Voltage versus Temperature Figure 5. Input Current versus Input Voltage 2.0 Vin = 4.0 V V OL, OUTPUT SATURATION (V) 1.5 TA = 85C TA = -40C 1.0 4.0 V Vin 10k Reset Reset TA = 25C 90% Vin = 5.0 V to 4.0 V RL = 10 k TA = 25C Vin 5.0 V - 0.5 10% 0 5.0V 4.0V REF 0 10 20 30 ISink, SINK CURRENT (mA) 40 200 ns/DIV Figure 6. Reset Output Saturation versus Sink Current Figure 7. Reset Delay Time http://onsemi.com 3 MC34064, MC33064, NCV33064 80 I F , FORWARD CURRENT (mA) Vin = 0 V TA = 25C 60 40 20 0 0 0.4 0.8 1.2 VF , FORWARD VOLTAGE (V) 1.6 Figure 8. Clamp Diode Forward Current versus Voltage + Power Supply - Input R Reset Microprocessor Circuit + 1.2 Vref CDLY GND A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 ms. Vth(MPU) is the microprocessor reset input threshold. 1 tDLY = RCDLY In Vth(MPU) 1Vin Figure 9. Low Voltage Microprocessor Reset TEST DATA RH + Power Supply + 1.2Vref VH 4.6 RH + 0.02 RL Iin Input VH (mV) RL Reset 20 51 40 81 71 112 100 164 190 327 276 480 DVth (mV) 0 3.4 6.8 6.8 10 10 16 16 34 34 51 51 RH (W) 0 10 20 20 30 30 47 47 100 100 150 150 RL (kW) 0 1.5 4.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 2.7 1.5 Microprocessor Circuit DVth(lower) 340 RH x 10-6 Where: RH 150 W Where: RL 1.5 W, 10 kW GND Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold (Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at 4.59 V. The equations are accurate to 10% with RH less than 150 W and RL between 1.5 kW and 10 kW . Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis http://onsemi.com 4 MC34064, MC33064, NCV33064 1.0k + Power Supply + 1.2Vref GND Input Reset + Input Reset + 1.2Vref GND Solar Cells Figure 11. Voltage Monitor 25mH Vin = 11.5 to 14.5V 470 22 4.7k 330 Input 1N756 Test + 680 1.2k MPSW51A + 470 1N5819 + Figure 12. Solar Powered Battery Charger VO = 5.0 V IO = 50 mA Conditions Vin = 11.5 V to 14.5 V, IO = 50 mA Vin = 12.6 V, IO = 0 mA to 50 mA Vin = 12.6 V, IO = 50 mA Vin = 12.6 V, IO = 50 mA Results 35 mV 12 mV 60 mVpp 77% Line Regulation Reset + 1.2Vref GND Load Regulation Output Ripple Efficiency Figure 13. Low Power Switching Regulator VCC RL MTP3055EL 270 4.6V Input Reset + 1.2Vref GND Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2 MOSFET. Figure 14. MOSFET Low Voltage Gate Drive Protection http://onsemi.com 5 MC34064, MC33064, NCV33064 ORDERING INFORMATION Device MC34064D-005 MC34064D-5G MC34064D-5R2 MC34064D-5R2G MC34064DM-5R2 MC34064DM-5R2G MC34064P-005 MC34064P-5G MC34064P-5RA MC34064P-5RAG MC34064P-5RP MC34064P-5RPG MC34064P-5RM MC34064P-5RMG MC34064SN-5T1 MC34064SN-5T1G MC33064D-005 MC33064D-5G MC33064D-5R2 MC33064D-5R2G MC33064DM-5R2 MC33064DM-5R2G MC33064P-005 MC33064P-5G MC33064P-5RA MC33064P-5RAG MC33064P-5RP MC33064P-5RPG MC33064SN-5T1 MC33064SN-5T1G TA = -40C to +85C TA = 0C to +70C Operating Temperature Range Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) Micro8 Micro8 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TSOP-5 TSOP-5 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) Micro8 Micro8 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TSOP-5 TSOP-5 (Pb-Free) 3000 Units / Tape & Reel 2000 Units / Ammo Pack 2000 Units / Tape & Reel 2000 Units / Bag 4000 Units / Tape & Reel 2500 Units / Tape & Reel 98 Units / Rail 3000 Units / Tape & Reel 2000 Units / Ammo Pack 2000 Units / Tape & Reel 2000 Units / Bag 4000 Units / Tape & Reel 2500 Units/ Tape & Reel Shipping 98 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: Tlow = -40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 6 MC34064, MC33064, NCV33064 ORDERING INFORMATION Device NCV33064D-5R2* NCV33064D-5R2G* NCV33064P-5RA* NCV33064P-5RAG* NCV33064P-5RP* NCV33064P-5RPG* NCV33064DM-5R2* NCV33064DM-5R2G* TA = -40C to +125C Operating Temperature Range Package SOIC-8 SOIC-8 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) Micro8 Micro8 (Pb-Free) 4000 Units / Tape & Reel 2000 Units / Ammo Pack 2000 Units / Tape & Reel Shipping 2500 Units / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV33064: Tlow = -40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. MARKING DIAGRAMS SOIC-8 D SUFFIX CASE 751 8 3x064 ALYW5 G 1 1 1 8 V3064 ALYW5 G 8 Micro8 DM SUFFIX CASE 846A 8 Ly50 AYW G G 1 VI50 AYW G G TO-92 P SUFFIX CASE 29 MC3x0 64P-5 ALYWW G G 1 23 NCV30 64P-5 ALYWW G G 1 23 TSOP-5 SN SUFFIX CASE 483 5 SRB AYW G G 1 MC34064 1 MC33064 5 SSN AYW G G x y A L Y W, WW G = = = = = = = 3 or 4 C or I Assembly Location Wafer Lot Year Work Week Pb-Free Package (Note: Microdot may be in either location) http://onsemi.com 7 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS SOIC-8 D SUFFIX CASE 751-07 ISSUE AJ -X- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 A 8 5 B 1 S 4 0.25 (0.010) M Y M -Y- G K C -Z- H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS Micro8 DM SUFFIX CASE 846A-02 ISSUE G D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. MILLIMETERS NOM MAX -- 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 MIN -- 0.05 0.25 0.13 2.90 2.90 INCHES NOM -- 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN -- 0.002 0.010 0.005 0.114 0.114 HE E PIN 1 ID e b 8 PL 0.08 (0.003) M TB S A S -T- PLANE 0.038 (0.0015) A1 SEATING A c L DIM A A1 b c D E e L HE MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 8X 3.20 0.126 4.24 0.167 5.28 0.208 6X 0.65 0.0256 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS TSOP-5 SN SUFFIX CASE 483-02 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 NOTE 5 2X D 5X 0.20 C A B M 0.10 T 0.20 T L A 5 1 2 4 3 2X B S K DETAIL Z G DETAIL Z C 0.05 H T SEATING PLANE J SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 mm inches SCALE 10:1 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 MC34064, MC33064, NCV33064 PACKAGE DIMENSIONS TO-92 (TO-226) P SUFFIX CASE 29-11 ISSUE AM A R P L SEATING PLANE B STRAIGHT LEAD BULK PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 --- K XX H V 1 D G J C N N SECTION X-X DIM A B C D G H J K L N P R V R A B BENT LEAD TAPE & REEL AMMO PACK P T SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 --2.04 2.66 1.50 4.00 2.93 --3.43 --- K G XX V 1 D J C N SECTION X-X DIM A B C D G J K N P R V Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 11 MC34064/D |
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